Lightweight : Their low density contributes significantly to weight reduction in applications.
Boron Nitride Cooling Filler Platelets CFP 001 and 003SF
The specialized BN filler platelets are particularly preferred for applications requiring extremely thin films, less than 25 μm, as well as for the production of fine fibers, intricate channels, and windings. Their ability to maintain structural integrity at minimal thickness makes them ideal for advanced electronic and thermal management systems. The CFP 003SF variant is engineered with a controlled top size, ensuring precise and uniform dispersion in the matrix, which enhances performance consistency in critical applications.
Boron Nitride Cooling Filler Platelets CFP 003E, 003, 006, 0075, 009, and 012
BN versatile filler platelets are the optimal choice for a wide range of applications, including thermal pads and injection molded parts. Their all-purpose nature ensures excellent compatibility with various polymer matrices, providing enhanced thermal conductivity while maintaining mechanical strength. These grades are specifically engineered to deliver consistent performance, making them ideal for use in electronics, automotive, and industrial components where efficient heat management is essential. Their adaptability also makes them suitable for customizing formulations to meet specific application requirements.
Boron Nitride Cooling Filler Platelets CFP 007HS
This grade is specifically designed for applications requiring thin films of less than 50 μm, making it an ideal choice due to its controlled top size, which ensures uniformity and precision. The CFP 007HS not only offers the highest reflectivity, essential for enhancing light management in optical and electronic applications, but also significantly boosts in-plane thermal conductivity in thermal pads. This makes it a superior option for critical environments where efficient heat dissipation and light reflection are paramount.
Boron Nitride Cooling Filler Granulated Platelets CFP 012P
These spray-dried boron nitride platelets are engineered to provide superior processability, making them an excellent choice for manufacturing processes requiring high precision and consistency. Their enhanced flowability ensures smooth integration into various polymer matrices, allowing for easy handling and uniform distribution during production. With high dosing velocities, CFP 012P is particularly well-suited for extruded and injection molded parts, enabling manufacturers to achieve optimal thermal management in complex geometries while maintaining the mechanical integrity of the final product. Additionally, their granulated form contributes to reduced dust formation.
Boron Nitride Cooling Filler Agglomerates CFA 250S
Soft agglomerates for high filler loadings. Excellent processability, flowability and high dosing velocities. Silicone TIMs (Thermal Interface Materials) are specialized materials used to enhance the thermal connection between electronic components and heat sinks or other cooling devices.
Boron Nitride Cooling Filler Agglomerates CFA 50M
Mix of agglomerates, platelets and boron nitride clusters. Boron nitride (BN) is a unique material often incorporated into potting resins to enhance their thermal management properties. Potting resins are used in electronics and other industries to encapsulate components, providing protection from environmental factors such as moisture, dust, and mechanical stress.
Boron Nitride Cooling Filler Flakes CFF 500-15 and 200-15
These premium-grade filler flakes are preferred for achieving the lowest possible viscosity in epoxy and silicone formulations, ensuring ease of processing and enhanced flow characteristics. Known for their exceptional thermal conductivity, they play a crucial role in effectively dissipating heat in high-performance applications. Moreover, their unique properties make them ideal for use in electronics, automotive, and industrial coatings, where managing thermal loads is critical.
3M™ Boron Nitride Cooling Fillers
3M™ Boron Nitride Cooling Fillers are advanced materials engineered to enhance thermal conductivity in various applications while maintaining electrical insulation. These fillers, based on hexagonal boron nitride (hBN), are widely used in industries that require efficient thermal management solutions without compromising electrical performance. Their unique combination of thermal conductivity, electrical insulation, and low density makes them ideal for applications in electronics, automotive, and LED lighting.
Chemical Formula : The chemical structure of boron nitride consists of alternating boron (B) and nitrogen (N) atoms, forming a hexagonal lattice, similar to the structure of graphite: BN\text{BN}BN
Key Features :
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High Thermal Conductivity : Boron nitride provides exceptional heat dissipation, enhancing the performance of electronic components, particularly in densely packed systems.
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Electrical Insulation : While offering high thermal conductivity, 3M™ Boron Nitride Cooling Fillers also maintain excellent electrical insulation, making them suitable for electronics and electrical devices.
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Low Density : The low density of hBN fillers contributes to lightweight designs, which is particularly beneficial for industries like automotive and aerospace.
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Chemical Stability : Boron nitride is chemically inert, offering stability in harsh environments, making it suitable for demanding applications.
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Low Dielectric Constant : This material has a low dielectric constant, which is crucial for minimizing signal interference in high-frequency electronic applications.
Applications
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Electronics and Semiconductors : Used as a filler in thermally conductive adhesives, potting compounds, and encapsulants to improve heat dissipation in electronic circuits, boards, and chips without compromising electrical performance.
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Automotive Components : Boron nitride cooling fillers enhance the thermal conductivity of materials used in electronic control units (ECUs), battery packs, and LED headlights, extending the lifetime of these components.
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LED Lighting : Applied in thermally conductive polymers and coatings for LED lighting, these fillers help in managing heat, ensuring the longevity and reliability of LED devices.
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Power Electronics : In power conversion systems like inverters and converters, boron nitride fillers help in efficiently managing thermal loads, preventing overheating and increasing energy efficiency.
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Thermal Interface Materials (TIMs) : Used in thermal interface materials, boron nitride fillers optimize the heat transfer between electronic devices and heat sinks, improving overall device performance.
Advantages Over Other Fillers
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Compared to Silica or Alumina Fillers : Boron nitride cooling fillers offer superior thermal conductivity with lower density and better electrical insulation.
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Compared to Carbon-Based Fillers : Unlike carbon fillers, which are electrically conductive, 3M™ Boron Nitride Cooling Fillers provide thermal conductivity without conducting electricity, making them preferable in many electronics applications.
Packaging and Quality Assurance : 3M™ Boron Nitride Cooling Fillers are available in various particle sizes and formulations, tailored to meet the specific needs of different industries. Each batch undergoes rigorous quality checks to ensure consistent performance, including tests for particle distribution, thermal conductivity, and electrical insulation properties.
Conclusione :3M™ Boron Nitride Cooling Fillers are the go-to solution for industries looking to optimize thermal management while maintaining electrical insulation. Their versatility, combined with high thermal conductivity, chemical stability, and low density, positions them as a crucial component in modern electronics, automotive, and lighting applications.
| Grade | Particle Size (µm) | Thermal Conductivity (W/mK) | Electrical Insulation | Applications |
|---|---|---|---|---|
| 3M™ BN Grade 100 | 3-5 | 10-20 | Excellent | Thermally conductive adhesives, encapsulants |
| 3M™ BN Grade 200 | 5-10 | 15-25 | Excellent | LED lighting, thermal interface materials (TIMs) |
| 3M™ BN Grade 300 | 10-15 | 20-30 | Excellent | Automotive electronics, power inverters |
| 3M™ BN Grade 400 | 15-20 | 25-35 | Excellent | Potting compounds, high-power semiconductors |
| 3M™ BN Grade 500 | 20-25 | 30-40 | Excellent | Battery packs, ECU systems, large power electronics |
| 3M™ BN Grade 600 | 25-30 | 35-45 | Excellent | Aerospace applications, heat management systems |