Electronic Coatings & Performance Additives
NEXABOR

Boron Nitride Powder
GPBN-01

Ultrafine hexagonal boron nitride powder engineered as a cooling filler for electrically insulating electronic coatings, encapsulants and thermal-interface formulations.

HEXAGONAL BN ULTRAFINE POWDER ELECTRICAL INSULATION

Move heat without creating an electrical pathway.

NEXABOR GPBN-01 is designed for electronic coating systems that must dissipate heat while maintaining electrical insulation. The platelet-like hexagonal structure can form thermally conductive pathways when correctly dispersed and oriented in the polymer matrix.

It is intended for formulation development in protective coatings, potting compounds, encapsulants, adhesives and thermal-interface materials. Final conductivity, viscosity and application behaviour depend on loading, particle orientation, resin chemistry, film thickness and processing.

Cooling with insulation:
Hexagonal boron nitride is often described as “white graphite” because its layered morphology supports heat transfer while remaining electrically insulating.

Chemistry h-BN
Morphology Platelet-Type
Electrical Behaviour Insulating
Form Ultrafine Powder
Build a thermal bridge through the coating.
The effectiveness of a cooling filler depends on particle contact, alignment and interfacial resistance—not filler presence alone.
1 · DISPERSE

Separate Agglomerates

Wet the ultrafine powder uniformly in the selected resin or carrier.

2 · CONNECT

Create Contact

Increasing filler contact helps establish continuous heat-transfer pathways.

3 · TRANSFER

Move Heat

Heat is conducted away from concentrated electronic hot spots.

4 · INSULATE

Protect Circuits

The dielectric filler supports electrical isolation within the coating matrix.

Designed for demanding electronic formulations.
Performance must be confirmed in the complete formulation and targeted film build.
01

Thermal Dissipation

Supports development of coatings that spread and transfer heat away from electronic components.

02

Electrical Insulation

Offers a non-metallic route to thermal management where electrical isolation is essential.

03

Ultrafine Integration

Fine powder format supports smooth films and use in thin-section coating development.

04

Chemical Stability

Inert ceramic chemistry is suited to durable protective electronic material systems.

05

Light Colour

White ceramic appearance is useful where dark conductive fillers are unacceptable.

06

Formulation Flexibility

Applicable to coating, adhesive, encapsulation and interface-material development.

Why filler networks
matter.
These conceptual graphics show formulation principles; they are not GPBN-01 test results.

Thermal Pathway Development

Conceptual thermal pathway development chart

Qualitative relationship: particle contact and orientation become increasingly important as loading rises.

Cooling Filler Positioning

Qualitative cooling filler positioning comparison

Qualitative positioning only. Actual comparison depends on grade, particle size, loading and matrix.

Select an electronic system.

Choose a category to review the role of GPBN-01.

ELECTRONIC COATINGS

Thermally Conductive Electronic Coatings

Applications

  • PCB protective coatings
  • Heat-spreading dielectric layers
  • Power-electronics coatings
  • LED and lighting assemblies
POTTING & ENCAPSULATION

Potting Compounds & Encapsulants

Applications

  • Power modules
  • Sensors and control units
  • Transformers and coils
  • Battery electronics
THERMAL INTERFACES

Thermal-Interface Materials

Applications

  • Gap-filling compounds
  • Dielectric heat-transfer layers
  • Thermal pads and sheets
  • Component-to-housing interfaces
ELECTRONIC ADHESIVES

Thermally Conductive Adhesives

Applications

  • Component bonding
  • Heat-sink attachment
  • LED assembly adhesives
  • Electrically insulating structural bonds
Balance cooling, viscosity and application.
Begin with a controlled loading ladder and compare every result against an unfilled control.
PRE-WET CAREFULLY
1

Pre-Wet Carefully

Add GPBN-01 gradually to the liquid phase under controlled mixing to minimise dry pockets and airborne dust.

CONTROL SHEAR
2

Control Shear

Use sufficient shear for deagglomeration while avoiding excessive processing that may damage platelet structure.

MANAGE RHEOLOGY
3

Manage Rheology

Track viscosity, thixotropy, levelling and sedimentation as filler loading increases.

OPTIMISE ORIENTATION
4

Optimise Orientation

Processing can align platelets; measure both through-plane and in-plane thermal performance where relevant.

VALIDATE THE FILM
5

Validate the Film

Test adhesion, flexibility, cure, dielectric strength, thermal cycling and humidity resistance.

CHECK COMPATIBILITY
6

Check Compatibility

Confirm stability in the specific epoxy, silicone, polyurethane, acrylic or hybrid binder.

Recommended development route: control → low loading → medium loading → high loading. At each step measure viscosity, application, thermal conductivity, dielectric behaviour, adhesion and cured-film reliability.
NEXABOR GPBN-01 at a glance.
Only supplied product identity is shown as confirmed. Numerical limits must be inserted from the approved product TDS.
PROPERTY PRODUCT INFORMATION RELEVANCE
Product Name NEXABOR GPBN-01 Electronic thermal-management additive
Chemistry Hexagonal Boron Nitride Thermally conductive, electrically insulating ceramic
Physical Form Ultrafine Powder Designed for coating and polymer incorporation
Colour / Appearance Refer approved TDS Batch acceptance criterion
Particle Size Refer approved TDS Influences smoothness, rheology and packing
Purity Refer approved TDS Important for electrical and thermal performance
Bulk Density Refer approved TDS Handling and volume-loading calculations
Moisture Refer approved TDS Storage and resin compatibility
Recommended Addition Establish by formulation trials Depends on target conductivity and viscosity
Quick formulation answers.

Quick Formulation
Answers

Why use boron nitride instead of a metal filler?
Hexagonal boron nitride offers a route to improved heat transfer without creating the electrical conductivity normally associated with metal fillers.
Can GPBN-01 be used in thin electronic coatings?
Its ultrafine powder form is positioned for coating development, but achievable film thickness and surface finish must be verified in the selected resin and application process.
Does a higher loading always give better performance?
Not automatically. Higher loading can improve particle contact but may sharply raise viscosity, reduce levelling or affect adhesion and flexibility. Optimisation is essential.
Which binder systems can be evaluated?
Potential systems include epoxy, silicone, polyurethane, acrylic and hybrid binders, subject to compatibility and end-use validation.
09 · Product documents
NEXABOR GPBN-01 downloads.

Place approved PDF documents beside this HTML file using the assigned filenames.

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