Electronic Coatings & Performance Additives
Advanced Electronics Materials

ELECTRONIC COATINGS
& ADDITIVES

Speciality chemistries for PCBA protection, solder-paste wetting, foam and flow control, electrical insulation and thermal management.

Conformal Protection SMT Process Control Thermal Management
ELECTRONIC MATERIALS STRATEGY

Match the chemistry to the performance
requirement

Reliable electronics require coordinated control of environmental protection, assembly wetting, coating quality, electrical insulation and heat dissipation.

01

Protect the complete assembly

Select PFAS-free, fluorinated ether or polysilazane hybrid coatings according to the required film profile, service temperature and chemical environment.

02

Control soldering and coating surfaces

Use S-386 for solder-paste wetting, or fluorosilicone additives for microfoam release, levelling and surface-defect control.

03

Manage heat while maintaining insulation

Use engineered boron nitride where thermal conduction and electrical isolation must be combined in a coating, adhesive or encapsulant.

Selection begins with the process

Consider substrate, application method, film thickness, cure conditions, operating environment and thermal target before finalising a chemistry.

Board protection: PFAS-free, fluorinated ether or polysilysazane
SMT wetting: S-386 fluorosurfactant
Film quality: fluorosilicone surface-control additives
Thermal pathway: electrically insulating boron nitride
PRODUCT PORTFOLIO

Six focused electronic-material
technologies

A concise platform covering protective coatings, SMT formulation additives, electrical insulation and thermal management.

SUSTAINABLE PROTECTION

PFAS-Free Conformal Coatings

Non-fluorinated protective coatings designed to provide dielectric insulation and environmental resistance on assembled circuit boards.

Primary Function Moisture and contamination barrier
Application Spray, dip or selective coating
Target Automotive, industrial and consumer PCBAs
SMT WETTING CONTROL

Wetting Agent S-386 for Solder Paste

High-efficiency fluorinated wetting additive for solder-paste and flux systems requiring strong surface-tension reduction at low dosage.

Chemistry C6 non-ionic fluorosurfactant
Typical Addition 0.05–0.15% active, subject to validation
Target Solder paste and no-clean flux
FOAM & FLOW CONTROL

Fluorosilicone Defoamers & Levelling Additives

Speciality surface-control additives that help suppress microfoam, improve flow and promote uniform film formation in electronic coatings.

Primary Function Defoaming, levelling and crater control
Formulation Use Solvent-borne and selected reactive systems
Target Conformal coatings, inks and encapsulants
ULTRA-THIN BARRIER

Fluorinated Ether-Based Conformal Coatings

Fast-drying, low-viscosity coatings that form transparent, ultra-thin hydrophobic films around complex electronic geometries.

Surface Function Water and moisture repellency
Film Profile Ultra-thin, low-build protection
Target Connectors, sensors and compact assemblies
THERMAL MANAGEMENT

Boron Nitride

Electrically insulating, thermally conductive ceramic fillers for managing heat in coatings, adhesives, encapsulants and polymer systems.

Core Property Thermal conductivity with electrical insulation
Material Form Engineered hexagonal boron nitride powders
Target TIMs, potting, adhesives and insulating coatings
HIGH-TEMPERATURE BARRIER

Polysilazane Hybrid Conformal Coatings

Hybrid inorganic–organic coatings for hard, thin protective films with enhanced thermal stability, chemical resistance and adhesion.

Primary Function High-temperature environmental protection
Film Character Hard, thin and chemically resistant
Target Power electronics and demanding PCBAs
PERFORMANCE FOCUS

Protection, process control and thermal
reliability

The six technologies address critical requirements from solder-paste formulation through long-term electronic service.

Moisture Barrier

Conformal films help isolate sensitive circuitry from humidity, condensation and liquid exposure.

Electrical Reliability

Protective coatings and boron nitride materials support electrical insulation in dense electronic systems.

Fine-Feature Coverage

Low-build fluorinated ether coatings protect compact assemblies where heavy film build is undesirable.

SMT Wetting

S-386 reduces surface tension to support controlled wetting in solder-paste and flux formulations.

Foam & Levelling Control

Fluorosilicone additives help minimise microfoam, craters and uneven film formation.

Heat Dissipation

Boron nitride improves thermal-management pathways while maintaining electrical insulation.

TARGET APPLICATIONS

Electronic systems exposed to demanding
environments

Protection and surface-control solutions for high-density assemblies across transport, communications, industrial and consumer electronics.

01 · AUTOMOTIVE

ECUs & Battery Management

Board protection for control modules and electronics exposed to temperature cycling, moisture and road contaminants.

ECU BMS Sensors
02 · INDUSTRIAL

Controls & Instrumentation

Barrier coatings for automation boards, power electronics and control assemblies in demanding service environments.

Controls Power Electronics PCBA
03 · CONSUMER

Wearables & Compact Devices

Thin liquid-repellent films for compact electronics where low weight and minimal coating thickness are important.

Wearables Audio Micro-Sensors
04 · SMT ASSEMBLY

Solder Paste & Flux

Surface-active modification to improve wetting behaviour in fine-pitch BGA and QFN assembly processes.

BGA QFN No-Clean Flux
05 · TELECOM

Network Electronics

Environmental protection for communication boards, antenna electronics and outdoor electronic hardware.

5G Network Boards Outdoor Systems
06 · SPECIALITY

Medical & Avionics

Coating selection for sensitive electronics requiring careful material, process and end-use validation.

Medical Avionics High Reliability
TECHNICAL SELECTION MATRIX

Choose by function and process stage

A direct comparison of the six focused electronic-material platforms.

Product Family Material Type Primary Function Application Stage Selection Focus
PFAS-Free Conformal Coatings Non-fluorinated polymer coating Dielectric and environmental protection Finished PCBA coating PFAS-free protection by spray, dip or selective application
Wetting Agent S-386 C6 non-ionic fluorosurfactant Surface-tension reduction and wetting Solder-paste or flux formulation Low-dose use after compatibility and residue testing
Fluorosilicone Additives Surface-control additive Defoaming, levelling and crater control Coating or encapsulant formulation Balance foam release with intercoat adhesion and surface quality
Fluorinated Ether-Based Coatings Low-viscosity fluorinated coating Ultra-thin moisture-repellent barrier Finished component or assembly Fine-feature coverage with minimal film build
Boron Nitride Thermally conductive ceramic filler Heat transfer with electrical insulation Compound, adhesive, potting or coating formulation Particle grade, loading, viscosity and thermal target
Polysilazane Hybrid Coatings Hybrid inorganic–organic coating Hard, thermally stable protective barrier Finished PCBA or component coating Cure conditions, adhesion and high-temperature performance
All values and suitability statements are indicative. Confirm the current TDS, SDS, substrate compatibility and complete production-line performance before commercial use.
Technical FAQs

Practical Product-Selection
Questions

Which conformal-coating platform should be selected?
Start with environmental exposure, film thickness, cure limits and regulatory positioning. PFAS-free, fluorinated ether and polysilazane systems serve different operating envelopes.
How should S-386 be introduced into solder paste?
Predilute where appropriate, add at low level and confirm wetting, slump, tack, residues, reflow behaviour and electrical reliability in the complete flux system.
What should be checked with fluorosilicone additives?
Evaluate foam release and levelling together with recoating, adhesion, cratering risk and surface compatibility; overdosing can create secondary defects.
Why use boron nitride in electronic materials?
Boron nitride can create thermally conductive pathways while retaining electrical insulation, making it useful in TIMs, potting compounds, adhesives and coatings.
Where do polysilazane hybrids add value?
They are considered where a thin, hard barrier with elevated thermal and chemical resistance is required, subject to cure and substrate- adhesion validation.
What is required before production approval?
Confirm substrate compatibility, processing window, electrical properties, thermal cycling, humidity resistance, chemical exposure and complete assembly performance.

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