Electronic Coatings & Performance Additives
Electronic Coatings & Additives · SMT Processing

S-386
WETTING AGENT

High-efficiency C6 non-ionic fluorosurfactant for controlled surface-tension reduction and wetting in solder-paste and electronic-flux formulations.

100% Active Low-Dosage Efficiency Solder Paste · No-Clean Flux

Improve wet-out without overloading the flux system.

S-386 is used at low active concentration to reduce surface tension and support uniform spreading of solder paste or liquid flux across compatible metal and solder-mask surfaces.

Final dosage must be established in the complete flux package. Evaluate print definition, slump, tack, reflow profile, solder-ball formation, residue behaviour and electrical reliability before production approval.

Active Content 100%
Surfactant Type Non-Ionic
Starting Addition 0.05–0.15%
Primary Role Wetting Control
Precision SMT Assembly
PRECISION SMT ASSEMBLY
Process Validation
PROCESS VALIDATION

Lower interfacial tension. Improve
controlled wet-out.

HIGHER SURFACE TENSION
S-386 MODIFIED WET-OUT
S-386 wetting mechanism
S-386 wetting mechanism
Surface control through the soldering cycle.
01 · SPREADING

Lower Surface Tension

Supports flux spreading across compatible substrates and fine features.

02 · WET-OUT

Promote Contact

Improves liquid contact where resin-rich systems show restricted wetting.

03 · UNIFORMITY

Control Coverage

Helps reduce local dewetting and uneven flux distribution.

04 · EFFICIENCY

Low-Dose Modification

Strong surface activity allows screening at low active addition.

Introduce S-386 in a controlled sequence.
STEP 1

Predilute

Prepare a 1:1 dilution in compatible IPA or ethanol when required for accurate dosing.

STEP 2

Add Low

Begin at 0.05% active and increase only when test data supports the change.

STEP 3

Homogenise

Add under controlled mixing without excessive aeration or solvent loss.

STEP 4

Reflow Test

Verify printing, wetting, residues and electrical performance on the actual line.

PARAMETER SCREENING DIRECTION REASON
Active Addition 0.05–0.15% of total formulation Find the minimum effective level
Predilution 1:1 with compatible IPA or ethanol Improve metering and distribution
Evaluation Print, tack, slump, reflow and residue testing Confirm complete-process compatibility
Designed for precision assembly formulations.
SOLDER PASTE

Solder Paste

Surface-tension adjustment for fine-pitch printing and reflow evaluation.

NO-CLEAN FLUX

No-Clean Flux

Wetting support while retaining controlled residue behaviour.

LIQUID FLUX

Liquid Flux

Spreading modification in compatible solvent and resin systems.

SPECIALITY ELECTRONICS

Speciality Electronics

Evaluation in BGA, QFN and densely populated assembly processes.

Approve the complete soldering system.
FORMULATION STABILITY
1

Formulation Stability

Check viscosity, separation and storage behaviour.

PRINT PERFORMANCE
2

Print Performance

Measure transfer efficiency, slump and stencil release.

REFLOW BEHAVIOUR
3

Reflow Behaviour

Review wetting, voiding, solder balls and residue appearance.

RELIABILITY
4

Reliability

Confirm ionic cleanliness, SIR and end-use requirements.

Quick technical answers.

Quick Technical
Answers

Is S-386 added directly?
It may be added directly, but a 1:1 predilution in compatible IPA or ethanol often improves low-level dosing and distribution.
What dosage should be used?
Begin around 0.05% active and screen up to approximately 0.15%. Use the minimum level that delivers the required wetting without disturbing paste rheology or residue performance.
Is S-386 PFAS-free?
No. S-386 is a C6 fluorinated surfactant. Review destination-market requirements and current supplier declarations before use.

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