Materials for electronic reliability

Electronics

Specialty additives and functional fillers for protection, thermal management, lightweighting, adhesion, surface control and long-term reliability.

Reliability engineering

Protection, heat and weight in balance.

Every electronic assembly is a materials trade-off. Geocon helps formulators balance moisture protection, heat dissipation, electrical insulation, adhesion, flexibility and cost—from bare board to finished device.

Protection ↔ Low Film Build
Heat Dissipation ↔ Insulation
Adhesion ↔ Flexibility
Coverage ↔ Cost
Reliability engineering for electronic assemblies
THE FORMULATION BENCH

Eight materials.
Every one
earns its place.

Select by physical form and the role required across coatings, potting compounds, thermal interfaces, adhesives and engineered housings.
EL-01PWD PWD

Hexagonal Boron Nitride

Thermally conductive yet electrically insulating platelet filler for TIMs, LEDs and power electronics.

THERMAL · ELECTRICALLY INSULATING
Explore GPBN →
EL-02PWD PWD

3M Hollow Glass Microspheres

Reduce density and shrinkage in epoxy/PU potting, housings and thermal-barrier coatings.

FILLER · DENSITY MODIFIER
Explore 3M Glass Bubbles →
EL-03LIQ LIQ

PFAS-Free Conformal Coatings

Thin-film moisture and contamination resistance for PCB, automotive, industrial and medical electronics.

PROTECTION · COATING
Explore circuit protection →
EL-04LIQ LIQ

Fluorosurfactants &
Super-Wetting Agents

Improve edge coverage and levelling while reducing craters and pinholes in coatings and inks.

SURFACE ADDITIVE · WETTING
Explore Fluorodyne →
EL-05LIQ LIQ

Adhesion Promoters

Improve bonding between epoxy, PU, silicone and hybrid polymers and metal, glass or ceramic.

BONDING · INTERFACE
Request grade selection →
EL-06LIQ LIQ

Silicone &
Silicone-Free Defoamers

Prevent voids, pinholes and insulation defects in potting, encapsulation, coatings and inks.

PROCESS · DEFECT CONTROL
Explore FOAMSTAB →
EL-07FIB FIB

Milled Glass Fibres

Reinforce housings, connectors and switchgear for dimensional stability and high-temperature performance.

REINFORCEMENT · MECHANICAL
Explore MILIGLASS →
EL-08PWD / LIQ PWD / LIQ

Antimicrobial
Additives

Durable hygiene protection for switches, control panels, touchscreens and healthcare electronics.

PROTECTION · SURFACE HYGIENE
Explore antimicrobial range →
ASSEMBLY PATHWAY

Build reliability
into every layer.

Material selection should move from the substrate and interface outward to thermal, protective and environmental demands.
01

Wet

Reach fine features, edges and complex PCB geometry.

02

Bond

Couple polymer to copper, aluminium, glass and ceramic.

03

Release Air

Prevent voids that weaken insulation and thermal contact.

04

Manage Heat

Create controlled conductive paths while preserving insulation.

05

Protect

Block moisture, contamination, chemicals and handling damage.

06

Validate

Test thermal cycling, dielectric performance and adhesion.

TECHNICAL PARTNERSHIP

Support from resin
compatibility to
reliability testing.

Shorten development through material selection, loading guidance and application-focused review.
01

System Mapping

Resin, substrate, cure, film build and service environment.

02

Material Selection

Particle morphology, surface chemistry, filler loading and ionic character.

03

Process Guidance

Dispersion, mixing order, vacuum, coating method and cure.

04

Reliability Review

Thermal cycling, dielectric strength, moisture and adhesion.

Twenty-four ways
the bench enters
a device.

Organised around protection, thermal performance, encapsulation and engineered component reliability.
Boards, Coatings & Interfaces
Conformal Coatings
PFAS-free barriers, wetting agents and defoamers for uniform PCB coverage.
Solder Masks & Electronic Inks
Levelling, dispersion and foam control for smooth, defect-free deposition.
Displays & Sensors
Thin protective films, stain resistance and low-surface-tension wetting.
Electronic Adhesives
Silane adhesion promoters and defoamers for durable metal, glass and ceramic bonds.
Camera & Optical Modules
Moisture and contamination protection subject to optical-transmission requirements.
Power, Potting & Components
Potting & Encapsulation
Glass bubbles, BN, adhesion promoters and defoamers for low-density, void-free protection.
LED & Power Electronics
Electrically insulating thermal fillers for heat transfer around high-power assemblies.
EV Battery Packs
Thermal barriers, lightweight encapsulation, heat spreading and protective coatings.
Transformers & Coils
Low-density fillers, thermal management and air release for reliable insulation.
Housings & Connectors
Reinforcement, dimensional stability, lightweighting and antimicrobial protection.

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