Electronic Coatings & Performance Additives
Electronic Coatings & Additives · Surface Control

FLUOROSILICONE
DEFOAMER

High-efficiency defoaming and levelling technologies for controlling microfoam, flow, craters and surface uniformity in demanding electronic coatings.

Microfoam Control Levelling & Flow Coatings · Inks · Encapsulants

Control foam without sacrificing the finished film.

Fluorosilicone additives combine powerful interfacial activity with compatibility that can be tuned for foam release, substrate wetting and levelling in high-value electronic formulations.

The strongest defoamer is not automatically the best additive. Selection must balance air release, flow, intercoat adhesion, recoatability, cratering risk and final electrical performance.

Defoaming Microbubble Release
Levelling Film Uniformity
Surface Control Crater Reduction
Selection Basis Compatibility Window
Precision SMT Assembly
DEFECT-FREE FILM TARGET
Process Validation
COATING PROCESS CONTROL

Release entrained air and equalise film flow.

MICROFOAM + UNEVEN FLOW
LEVEL FILM
S-386 wetting mechanism
One platform, several interfacial controls.
01 · DEFOAMING

Break Microfoam

Promotes coalescence and release of entrained air during mixing and application.

02 · LEVELLING

Improve Flow

Reduces local surface-tension differences that can create waviness and defects.

03 · WETTING

Reach Fine Geometry

Supports controlled coverage over complex substrates and component edges.

04 · APPEARANCE

Reduce Craters

Helps maintain a uniform protective film when properly matched to the binder.

Match controlled incompatibility to the formulation.
SELECTION NEED PREFERRED BEHAVIOUR WATCH POINT
Rapid Foam Knockdown Higher defoaming activity Cratering and local film defects
Fine Levelling High compatibility and surface flow Intercoat adhesion and recoatability
Thick Encapsulant Air release under high viscosity Migration during cure
Electronic Coating Uniform coverage with low residue risk Electrical and cleanliness requirements
STEP 1

Blank Test

Record baseline foam, flow and surface defects.

STEP 2

Low-Dose Screen

Begin at the supplier's lowest recommended level.

STEP 3

Apply & Cure

Test under actual shear, film thickness and cure conditions.

STEP 4

Reliability Check

Confirm adhesion, electrical behaviour and ageing.

Surface control across electronic materials.
CONFORMAL COATINGS

Conformal Coatings

Microfoam, cratering and levelling control in thin protective films.

ELECTRONIC INKS

Electronic Inks

Flow and bubble control in functional and protective ink systems.

POTTING COMPOUNDS

Potting Compounds

Air release in filled, higher-viscosity encapsulation materials.

ADHESIVES & SEALANTS

Adhesives & Sealants

Controlled foam release and surface appearance in precision bonding.

Judge the cured film— not only the mixing vessel.
FOAM PROFILE
1

Foam Profile

Measure initial foam, break time and microbubble release.

SURFACE QUALITY
2

Surface Quality

Inspect levelling, craters, pinholes and edge coverage.

ADHESION
3

Adhesion

Check substrate and intercoat adhesion after cure and ageing.

ELECTRICAL RELIABILITY
4

Electrical Reliability

Verify insulation, ionic cleanliness and end-use requirements.

Quick selection answers.

Quick Selection
Answers

Can one grade provide both defoaming and levelling?
Yes, but the optimum balance depends on resin, solvent, pigment or filler loading, application method and cure. Comparative screening is required.
What happens when the additive is overdosed?
Excess may cause craters, reduced adhesion, migration, gloss variation or recoat problems. Use the minimum effective level.
When should the additive be introduced?
Depending on the grade, it may be added during grind, let-down or final adjustment. Final addition often allows more controlled optimisation.

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