Electronic Coatings & Performance Additives
Electronic Coatings & Additives · Circuit Protection

SFCOAT
PFAS-FREE

Ultra-thin conformal coating technology engineered in Japan for moisture protection of printed circuit boards, electronic assemblies, sensors and connectors.

Sub-Micron Film Room-Temperature Drying Spray · Dip · Selective Coat

A nearly invisible barrier for exposed electronics.

Conformal coatings follow the contours of a printed circuit assembly to protect conductors, solder joints and components from moisture, corrosion, dust and chemical contamination. SFCOAT provides this barrier through a PFAS-free, ultra-thin coating route.

The attached SFCOAT presentation positions the technology for automotive, industrial, medical and general electronic assemblies where conventional fluorinated materials face increasing supply-chain and sustainability scrutiny.

FILM THICKNESS <1 μm
FLASH POINT None Stated
THERMAL MARKER ≥200°C Decomposition
YT-MP VISCOSITY 1.5 mPa·s

Explore the SFCOAT product families.

100% FLUORINE-FREE EFFECTIVE INGREDIENT

SFCOAT MP Series

PFAS-free conformal protection positioned as a direct response to fluorinated-material restrictions.

Product route

  • Ultra-thin moisture-resistant surface barrier
  • Sub-micron coating thickness
  • Room-temperature drying
  • Evaluate application viscosity and solvent route against the approved grade TDS
MP-SOLVENT-BASED FORMULATION

SFCOAT YT-MP Series

Fluorine-free formulation optimised for uniform deposition over complex PCB geometries.

Product route

  • YT-MP viscosity stated as 1.5 mPa·s
  • Excellent flow around components and fine features
  • Ultra-thin, uniform film deposition
  • Suitable for spray, dip and selective-coating evaluation

How SFCOAT protects a circuit.

The coating forms a thin barrier that follows the surface geometry without creating a heavy encapsulating layer.
1
PREPARE

Clean the Assembly

Remove flux residues, oils, dust and moisture according to the qualified process.

2
APPLY

Deposit the Fluid

Use spray, dip or selective coating to reach the intended circuit areas.

3
FLOW

Cover Fine Geometry

Low viscosity supports wetting around components, leads and board features.

4
DRY

Form the Barrier

Room-temperature drying develops an ultra-thin protective film.

Sub-Micron Film Concept

SFCOAT is positioned below 1 μm film thickness.

SFCOAT Sub-Micron Film Concept
Conceptual cross-section; component dimensions are not to scale.

Barrier Protection Logic

A continuous film separates susceptible surfaces from environmental exposure.

SFCOAT Barrier Protection Logic
Conceptual protection graphic, not a measured transmission result.
Thin protection without a heavy process.
Final performance must be validated on the actual assembly, cleanliness level and application process.
01 · MOISTURE

High Moisture Resistance

Barrier protection at sub-micron film thickness as positioned in the SFCOAT presentation.

02 · PROCESS

Room-Temperature Drying

No oven requirement, supporting lower process energy and simpler line integration.

03 · FIRE

No Stated Flash Point

The supplied presentation positions the product as non-flammable for factory handling.

04 · SUBSTRATES

Broad Compatibility

Presented for evaluation on metals, plastics, ceramics and mixed electronic assemblies.

05 · GEOMETRY

Low Dimensional Impact

Sub-micron deposition supports protection around fine-pitch and compact components.

06 · TRANSITION

PFAS-Free Route

Supports material substitution projects where fluorinated chemistry is being removed.

SFCOAT versus traditional PFAS coatings.
Comparison reproduces the positioning in the supplied SFCOAT presentation; validate against the exact incumbent product.
SELECTION FACTOR SFCOAT PFAS-FREE TRADITIONAL PFAS COATING
Chemistry
Positioning 		Fluorine-free / PFAS-free route Fluorinated chemistry
Film Thickness <1 μm 1-25 μm typical, as stated in source comparison
Flash Point None stated Varies by product and carrier
Oven Cure Not required Often required, product-dependent
Substrate Positioning Metals, plastics and ceramics Product-dependent
Regulatory Review Request current PFAS declaration and compliance documentation Review chemistry against destination-market requirements
Regulatory note: PFAS, REACH, RoHS, TSCA and market-access statements must be supported by current supplier declarations and evaluated for the exact product, end use, destination country and reporting threshold.
Protection across high-value assemblies.
Masking, keep-out areas, connector interfaces and test points must be defined before coating.
PCBs

Printed Circuit Assemblies

Moisture and contamination barrier for populated boards.

AUTOMOTIVE

ECUs & Control Modules

Protection for electronic assemblies exposed to temperature and humidity cycling.

INDUSTRIAL

Controls & Power Electronics

Barrier protection for harsh factory and process environments.

SENSORS

Precision Devices

Ultra-thin coverage for compatible sensor assemblies and housings.

CONNECTORS

Interfaces & Terminations

Selective protection around contacts after keep-out definition.

MEDICAL

Medical Electronics

Evaluation route for protected electronics subject to application-specific qualification.

Choose the deposition process by production geometry.
Process settings must be qualified against coverage, masking, dry time and electrical performance.
SPRAY

Manual or Automated Spray

Flexible coverage for boards with defined masking and controlled atomisation.

DIP

Immersion Coating

Broad assembly coverage with withdrawal-rate and drainage control.

SELECTIVE

Programmed Deposition

Targeted coating around keep-out zones, connectors and test points.

From evaluation sample to production release.
Use customer, industry and assembly-specific standards to define acceptance.
SCREEN
1

Compatibility

Check plastics, markings, adhesives, solder mask and metal surfaces.

OPTIMISE
2

Application

Set coating amount, spray/dip parameters, drainage and drying time.

TEST
3

Protection

Evaluate moisture, insulation, corrosion and temperature cycling as required.

CONTROL
4

Production

Define incoming QC, bath or spray controls and inspection criteria.

Quick technical answers.

Quick Technical
Answers

What is the difference between MP and YT-MP?
The source positions MP as the 100% fluorine-free effective-ingredient series and YT-MP as a fluorine-free formulation using an MP solvent base, optimised for ultra-thin, uniform deposition.
How thick is the SFCOAT film?
The supplied presentation states a film thickness below 1 μm. Confirm the measurement method and target coat weight in the grade-specific TDS.
Does SFCOAT require oven curing?
The source states room-temperature drying with no oven required. Confirm actual dry time under the production temperature, humidity and airflow.
How should PFAS-free status be documented?
Request the current supplier PFAS declaration, composition statement and destination-market compliance documents for the exact grade and lot.

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